STRESS CHARACTERIZATION OF EVAPORATED GOLD LAYERS ON PHOTORESIST FOR RF-SWITCHES
K. YACINE, F. FLOURENS, X. LAFONTAN, Q.-H. DUONG, L. BUCHAILLOT, D. PEYROU, P. PONS, R. PLANA

Abstract. An analysis has been conducted to determine biaxial initial stresses in gold bilayer switches processed with sacrificial photoresists. The electroplated gold layer was characterized by wafer curvature technique and an analytical method based on the cantilever deflection method is investigated numerically and experimentally to characterized the evaporated gold seed layer.