HIGH PERFORMANCE COPPER/POLYIMIDE INDUCTORS FABRICATED USING THICK DOUBLE METALLAYER DAMASCENE PROCESS
M. PISANI, C. HIBERT, D. BOUVET, C. DEHOLLAIN, A. M. IONESCU

Abstract. This paper presents fabrication results and RF characterization and modeling of highperformance thick copper / polyimide inductors. Quality factors in excess of 15 and resonant frequencies in excess of 10 GHz were demonstrated using 5-μm-thick copper layers on top of highresistivity silicon wafers, a performance that cannot be obtained using other conventional fabrication technologies.