FOTURAN MICROMACHINED PACKAGES FOR RF MEMS SWITCHES
D. PEYROU, P. PONS, A. NICOLAS, J.W. TAO, H. GRANIER, R. PLANA

Abstract. RF-MEMS devices are made of moveable and timy structures (membranes, beams, cantilevers,…) that must be encapsulated in order to protect them from harmfull environmental influences, to increase their reliability and lifetime. This paper elaborates on the design and RF simulations show minimal impact of the package on the RF losses if the cap has a maximal thickness of 200 µm for the wall above the feedthrough and for a sealing ring in BCB about 10 µm thickness.