INTERESTS OF POLYMERS IN RF
MEMS APPLICATIONS
K. GRENIER, D. DUBUC, J-P. BUSQUERE, F. BOUCHRIHA, A. RENANNE, P. PONS,
R. PLANA
Abstract. The attractive properties of polymers, such as low microwave
losses, low tensile stress and multilayer possibility, have enhanced their
use in the microwave and millimeterwave fields and in particularly the RF
MEMS applications. Their utilization from the minimization of losses
through different process techniques (thick polymer layer deposited on a
lossy substrate or as a dielectric membrane combined to the Si bulk
micromachining) up to the 3D integration of microsystems above IC’s
present great interest and is specified in this paper. A special attention
has been given to the compatibility of these chemicals and their
associated microelectronic techniques with active devices performances.
Index terms. Polymer, RF MEMS, microwave, millimeterwave, process
compatibility. |