RELIABILITY ASPECTS OF THERMAL RF-SENSING STRUCTURES ON MICROMACHINED AlGaAs/GaAs MEMBRANES
K. MUTAMBA, C. SYDLO, L. DIVAC KRNIC, B. MOTTET, I. AHMED ALI, H. L. HARTNAGEL

Abstract. This paper reports on a reliability analysis made on micromachined millimeter-wave power sensing structures by means of electrical pulses. As the main result of the pulsed electrical stress a degradation of the sensor bolometric termination is observed. Different geometries are considered and the corresponding degradation process analysed.