DIMENSIONING OF ELECTROMAGNETIC COUPLERS FOR 0-LEVEL PACKAGED MICROWAVE POWER LIMITERS BASED ON ELECTRON EMITTER ARRAY
A. PHOMMAHAXAY, G. LISSORGUES, L. ROUSSEAU, T. BOUROUINA, P. NICOLE

Abstract. This paper presents the development of an RF interconnection method based on electromagnetic coupling associated with wafer-level packaging aimed at minimizing the leakage probability. After a discussion on the dimensioning of the interconnection for different frequency bands, electromagnetic simulations and measurements will be compared.